PICOSECOND LASER CUTTING AND SPLITTING MACHINE HGQL SERIES

The HGQL picosecond laser cutting and splitting machine is used for high-precision glass cutting and processing. Its characteristics are high cutting accuracy and high yield, especially for the cutting of irregular glass, which has significant advantages.

 

Device Name
Picosecond laser cutting and splitting machine
Processing glass size
1000mm*1000mm
Glass thickness
2mm~12mm
Accuracy
≤±0.1mm
Cutting linear speed
600mm/S(thickness 2mm)
Laser type
picosecond laser